Agenda

MEMS Manufacturing 2018
3rd Annual Conference and Exhibition
August 1-2, 2018
Santa Clara, California

Wednesday, August 1

Registration and Breakfast 07:30 AM – 08:30 AM
Welcome and Opening Remarks

Mike Pinelis, PhD
President and CEO
Microtech Ventures / MEMS Journal


08:30 AM – 09:00 AM
Rapid Innovation with Production MEMS

Ron Polcawich, PhD
Program Manager
DARPA


09:00 AM – 09:35 AM
Gold Sponsor Introduction - Micralyne 09:35 AM – 09:45 AM
Silver Sponsor Introduction - OnScale 09:45 AM – 09:55 AM
Mid-Morning Break 09:55 AM – 10:35 AM
Flexible Hybrid Electronics and MEMS Integration: Applications, Challenges, Approaches, and Technology Gaps

Wilfried Bair
Vice President of Engineering
NextFlex


10:35 AM – 11:10 AM
MEMS Supply Chain Challenges Facing the 200mm/150mm More than Moore Equipment Market

Simon Binns
Product Line Manager
Applied Materials


11:10 AM – 11:45 AM
Silver Sponsor Introduction - IMT 11:45 AM – 11:55 AM
Silver Sponsor Introduction – SAES Group 11:55 AM– 12:05 PM
Networking Lunch 12:05 PM – 01:30 PM
Manufacturing Challenges for Emerging MEMS Technologies

Peter Meijer, PhD
European Technology Manager
Lam Research


01:30 PM – 02:05 PM
Gas Sensors: An Overview of Fabrication Techniques, Device Comparisons, and Emerging Trends

Hossain Fahad, PhD
Post-Doctoral Researcher
Berkeley Sensor and Actuator Center (BSAC)

02:05 PM – 02:40 PM
Process Development for Novel Digital Micromirror Architectures
Sean O’Brien
Distinguished Member Technical Staff
Texas Instruments
02:40PM – 03:15 PM
Silver Sponsor Introduction - ULVAC 03:15 PM – 03:25 PM
Program Sponsor Introduction - Evatec 03:25 PM – 03:35 PM
Mid-Afternoon Break 03:35 PM – 04:15 PM
Technology Showcase

Allan Biegaj
Sales Representative
AARD Technology


Arash Mirhamed
Product Manager
Accurion


Ari Kuukkula
Sales Director
Afore


Ginny Ho
Manager, Analytic Testing Laboratory
Nordson Sonoscan


Hari Hegde, PhD
Ion Beam Technology Manager
Plasma-Therm

04:15 PM – 05:30 PM
Concluding Remarks

Mike Pinelis, PhD
President and CEO
Microtech Ventures / MEMS Journal


05:30 PM – 05:40 PM
Reception 05:40 PM – 07:00 PM

Thursday, August 2

Registration and Breakfast 07:30 AM – 08:30 AM
Welcome and Opening Remarks

Mike Pinelis, PhD
President and CEO
Microtech Ventures / MEMS Journal


08:30 AM – 08:45 AM
MEMS Manufacturing Processes and Packaging: Have the Limits Been Reached?

Romain Fraux
CTO
System Plus Consulting

08:45 AM – 09:20 AM
Blockchain Applications in the MEMS, Semiconductors, and Electronics Industries

Christophe Begue, PhD
Director Solution Strategy and Business Development
IBM

09:20 AM – 09:55 AM
Lunch Sponsor Introduction - BSAC 09:55 AM – 10:05 AM
Lunch Sponsor Introduction - GDSI 10:05 AM – 10:15 AM
Mid-Morning Break 10:15 AM – 10:55 AM
MEMS Manufacturing 2.0: Interactive Roundtable Discussion 10:55 AM – 11:55 AM
Lunch Sponsor Introduction - Polytec 11:55 AM – 12:05 PM
Internet Sponsor Introduction – MEMS Foundry 12:05 PM – 12:15 PM
Networking Lunch 12:15 PM – 01:45 PM
Innovation Showcase

Environment Resistant Package Technology for MEMS Applications
Jay Mitchell, PhD
President
ePACK


MEMS Switch Fabrication: Comparison of Surface and Bulk Micromachining
Chris Gudeman
CTO
IMT


Advanced Packaging for High-Performance, Ultra-Low Cost Amperometric Gas Sensors
Joseph Stetter, PhD
President and CTO
SPEC Sensors


Laser-Induced Molybdenum Carbide-Graphene Composites for 3D Foldable Paper Electronics
Liwei Lin, PhD
Professor
University of California, Berkeley


Increased Output-Pressure PMUTs with a Sloped Profile Fabricated via Surface Micromachining
Ray Luo
Post-Doctoral Researcher
BSAC


Flexible Integration and Scalability for RF MEMS Solutions
David Molinero
Principal MEMS Development Engineer
Wispry


01:45 PM – 04:00 PM
Concluding Remarks

Mike Pinelis, PhD
President and CEO
Microtech Ventures / MEMS Journal


04:00 PM – 04:15 PM

Agenda and panels are subject to change.