MEMS Manufacturing 2017
2nd Annual Conference and Exhibition
August 2–3, 2017
Santa Clara, California

Wednesday, August 2

Registration and Breakfast 07:00 AM – 08:00 AM
Welcome and Opening Remarks
Mike Pinelis, PhD
President and CEO
MEMS Journal
08:00 AM – 08:30 AM
MEMS sensors and the supply chain: improving time to market
Roc Blumenthal
Senior Director of Marketing
Semiconductor Manufacturing International Company (SMIC)
08:30 AM – 09:05 AM
MEMS technology transfer challenges and design for manufacturing
Mary Ann Maher, PhD
09:05 AM – 09:40 AM
Gold Sponsor Introduction – WACKER 09:40 AM – 10:00 AM
Mid-Morning Break 10:00 AM – 10:40 AM
Emerging 3D integration technologies for MEMS fabrication
Lutz Hofmann, PhD
Senior Scientist
Fraunhofer ENAS
10:40 AM – 11:15 AM
Electrochemical processing for MEMS applications: what might you need to know?
Kevin Witt
ClassOne Technology
11:15 AM – 11:50 AM
Silver Sponsor Introduction - Micralyne 11:50 AM – 12:00 PM
Internet Sponsor Introduction – Plasma-Therm 12:00 PM – 12:10 PM
Networking Lunch 12:10 PM – 01:30 PM
Metallization of high aspect ratio TSVs for MEMS applications
Vincent Mevellec, PhD
Sr. Director of Technology and R&D
01:30 PM – 02:05 PM
MEMS manufacturing in China: recent trends and ecosystem developments
Doug Sparks, PhD
CTO and Executive Vice President
Hanking Electronics
02:05 PM – 02:40 PM
Innovation Sponsor Introduction – Quantum Analytics 02:40 PM – 02:50 PM
Mid-Afternoon Break 02:50 PM – 03:30 PM
Technology Showcase

Allan Biegaj
AARD Technology

Sanjay Shinde, PhD
Sr. Manager
Canon USA

Gregg Moore
Technical Sales Engineer
Heidelberg Instruments

Jean–Pol Delrue, PhD
Business Development
LPKF Laser and Electronics

Sarah Okada
VP of Products and Applications

Ginny Ho
Automation Prospect Specialist

Luis Fernandez
Sr. Manager Technical Marketing

Bill Moffat
CEO & Founder
Yield Engineering Systems

03:30 PM – 05:30 PM
Concluding Remarks 05:30 PM – 05:40 PM
Reception 05:40 PM – 07:30 PM

Thursday, August 3

Registration and Breakfast 07:30 AM – 08:30 AM
Welcome and Opening Remarks
Mike Pinelis, PhD
President and CEO
MEMS Journal
08:30 AM – 08:45 AM
Metrology tools for MEMS manufacturing: an overview of existing and emerging options
Wojtek Walecki, PhD
Frontier Semiconductor 
08:45 AM – 09:20 AM
MEMS bonding techniques: emerging trends and processes
Rachid Abdallah
Research and Development Engineer
MSG Lithoglas 
09:20 AM – 09:55 AM
Gold Sponsor Introduction – X-FAB 09:55 AM – 10:05 AM
Mid-Morning Break 10:05 AM – 10:45 AM
Evaluating the hermeticity of MEMS device packaging
Steve Martell
Manager, Technical Support
10:45 AM – 11:20 AM
Plasma dicing for MEMS fabrication
Christopher Johnston
Business Development Manager for Advanced Packaging
11:20 AM – 11:55 AM
Lunch Sponsor Introduction – Plan Optik 11:55 AM – 12:05 PM
Networking Lunch 12:05 PM – 01:15 PM
Microbolometer based imaging systems: leveraging high-volume manufacturing in commercial MEMS foundries
KG Ganapathi, PhD
Co-Founder and CEO
INVIS Technologies
01:15 PM – 01:50 PM
Lithography for MEMS device fabrication: using standard processes for patterning of non-standard materials
Jay Sasserath, PhD
General Manager
Advanced Micro Patterning
01:50 PM – 02:55 PM
Fabrication and packaging of microfluidic chips
Mingqiang Yi, PhD
Microfluidic Foundry
02:25 PM – 03:00 PM
Silver Sponsor Introduction – ULVAC 03:00 PM – 03:10 PM
Mid-Afternoon Break 03:10 PM – 03:50 PM
MEMS and Sensors Startup Showcase

Paul Dhillon
Integra Devices

Janet Hur, PhD

Osama Khan, PhD

Arthur Montazeri, PhD

Ian Campbell

03:50 PM – 05:30 PM
Concluding Remarks 05:30 PM – 05:40 PM

Agenda and panels are subject to change.