Exhibit packages for MEMS Manufacturing 2017 are available. For further information and questions about exhibiting, please click here.


AARD Technology is the U.S. representative for scia Systems GmbH, a German supplier of specialized plasma and ion beam process equipment. We offer systems for coating, etching, and localized trimming for the MEMS, microelectronics, and optics industries. Technical support and 24 x 7 service hotlines ensure high volume manufacturers enjoy maximum uptime.


Afore offers sensor test solutions for R&D and laboratory phase, high volume production and sensor post assembly testing. A modular inertial test system, METIS, was released in May 2017, bringing automotive grade accuracy available in sensor development phase. Afore is a forerunner in wafer level testing. Fully automatic probers with physical stimulus, AIOLOS and KRONOS, are available for environmental and motions sensors enabling sensor manufacturers to utilize all benefits of chip scale packaging technology. Tri-temp strip level test systems for inertial sensor provide the most accurate calibration in the industry for automotive ESC sensors. Established in 1995, Afore is the experienced partner in the area of sensor testing.


Canon’s Industrial Products Group offers manufacturing equipment (PVD, etching, lithography, vacuum components, etc.) for semiconductor and other industries. We have 50 years of experience in vacuum technology and related equipment manufacturing. Our PVD product line includes oblique sputtering that enables precise film deposition with exceptional uniformity. These products can be adapted for a wide range of wafer sizes. Recently, we released following products: wafer bonding equipment and X-ray source for testing. Wafer bonding equipment employs a new technology that offers permanent bonding at room temperature and without application of high pressure. All kinds of wafers can be bonded using this technology. X-ray source for testing is a transmissive type microfocus source that is designed to enable high speed imaging. It offers high (4μL/S) resolution at 10W. It features self-diagnosis of X-ray tube life, is target maintenance-free, and warms up within 3 minutes.


FRT is recognized as a valued partner for non-contact, optical metrology systems. FRT of America serves you by providing high quality automated measuring tools which fulfill your research, inspection and process verification needs. Delivering increased manufacturing yield, enhanced productivity, improved quality and product performance, because that’s what it’s about at the end of the day. The MicroProf TTV measures samples thickness, TTV, bow and warp for full thickness, thinned and bonded wafers and substrates. The MicroSpy Topo DT is a high-resolution 3D microscope with confocal and interferometric measuring modes for a wide range of applications.


Hanking Electronics focuses on MEMS design, fabrication and marketing MEMS products and related electronics components. Hanking has an R&D center in Cleveland, Ohio, and a world-leading MEMS R&D team. Hanking also has 5 locations in 4 countries around the world. Focused on MEMS sensor IDM, Hanking owns an 8-inch wafer MEMS fab. Hanking's products include MEMS pressure sensors, strain gauges, accelerometers, gyros, flow sensors, temperature sensors and humidity sensors. Hanking can be an OEM/ODM for a strategy customer, providing service from design to fabrication services. Hanking has passed the quality management system certification, including IOS90000 and ISO/TS 16949. Quality management systems integrate all core processes, including burn-in reliability, technology development and production process, process reliability monitoring during manufacturing. design service quality monitoring, customer satisfaction monitoring, etc. Hanking can ensure product uniformity and handle different customers’ different requirements.


Heidelberg Instruments is a world leader in the production of high precision photolithography systems and maskless aligners. We have more than thirty years of experience in maskless photolithography and are proud of our ever-expanding installation base of over 750 systems in more than 50 countries. Heidelberg Instruments systems are installed in academic and industrial sites in more than 50 countries and are used in research, development and production. Applications include MEMS, bioMEMS, nanotechnology, ASICS, TFT, micro optics and others.


KST World Corp. services as a wafer foundry providing various services, especially super thick oxide film up to 12 inch size over 25um, with patented technology for over 18 years. Using thick oxide film technology, we provide unique thick BOX SOI wafer not only normal SOI wafer or cavity SOI wafer. Today, KST World’s unique and advanced technologies meet and drive customer’s technological requirements in worldwide market.


Lithoglas designs, and manufactures structured glass thin film solutions, and wafer-level glass caps and silicon cap substrates. Our wafer-level hermetic structured borosilicate glass layers to MEMS, MOEMS or optoelectronic devices, for the passivation or encapsulation of electronic components and semiconductors. The sensitive chip areas are sealed directly by glass thin film deposition or glass cap encapsulation on wafer-level. This enables use of plastic-molded packages to a high reliability level for replacing costly conventional packages like glass-metal or ceramics. Lithoglas passivations provide a direct hermetic and transparent sealing of the chip surface to promote cost-efficient packages of reduced size, while our substrates are glass capping solutions bonded at the wafer-level to enable chip size packages, and can also be designed to fit for conventional chip-on-board packaging. In addition, Lithoglas wafer-level-capping provides the advantage of placing several thousand glass caps simultaneously with high precision in a clean-room environment assuring high quality and a minimum defect rate.


LPKF Laser & Electronics AG is an internationally operating specialist in micro-material processing. With branches and representative offices in 79 countries, more than 700 employees and 24/7 service worldwide, LPKF relies on advanced technology, extensive specialized knowledge and outstanding service quality. LPKF produces machines and laser systems which are used in electronics manufacturing, medical technology, the automotive industry and in the manufacture of solar cells. Even after more than 25 years of intensive work with laser systems, laser technology has lost none of its fascination. LPKF has become a market leader during this time: through its core expertise in laser micro-material processing, optics, laser, control and drive technology, systems are created that ensure particularly economical production processes and new products. The products and services cover the following areas: electronics development equipment, electronics production equipment, and other production equipment.


Micralyne is a leading independent MEMS and microfabrication foundry. We excel at creating process technology for complex MEMS devices and execute disciplined volume manufacturing. Micralyne extends its value to our customers by offering extensive packaging, testing, and design services, beyond a typical MEMS chip foundry. This Foundry Plus model has successfully produced products for industries such as: life sciences, aerospace, automotive, oil and gas, telecom, and industrial sensors. Micralyne offers our customers a strategic partnership with deep technical knowledge and fabrication capabilities. Our fabrication services fit their need by providing established process platforms and timely device fabrication through early prototype, qualification, and volume manufacturing.


Since 1980, Nikon Corporation has been revolutionizing lithography with innovative products and technologies. The company is a worldwide leader in semiconductor lithography systems for the microelectronics manufacturing industry with more than 8,000 (semiconductor) lithography systems installed worldwide. Nikon offers the most extensive selection of production-class steppers and scanners in the industry. These products serve the semiconductor, flat panel display (FPD) and thin-film magnetic head (TFH) industries. The extensive Nikon product portfolio includes specialized lithography solutions for MEMS, LED, and packaging applications as well. Nikon Precision Inc. provides service, training, applications and technical support, as well as sales and marketing for Nikon lithography systems in North America.

Plan Optik AG is the leading manufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals, these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision surfaces in the ångström range, which are achieved through the use of the MDF polishing process developed by the company. Plan Optik wafers are available to minimum tolerances with application-specific structuring and complex material combinations. Plan Optik AG's extensive experience in the integration of optical, electronic or chemical functions within a wafer as the basis of MEMS applications has made the company the preferred partner of large international manufacturers.


Plasma-Therm® is a leading provider of advanced plasma processing equipment. Plasma-Therm systems perform critical process steps in the fabrication of integrated circuits, micro-mechanical devices, solar power cells, lighting, and components of products from computers and home electronics to military systems and satellites. Specifically, Plasma-Therm systems employ innovative technology to etch and deposit thin films. The company's Mask Etcher® series for photomask production has exceeded technology roadmap milestones for more than 15 years. Plasma-Therm’s Singulator® systems bring the precision and speed of plasma dicing to chip-packaging applications. Manufacturers, academic and governmental institutions depend on Plasma-Therm equipment, designed with “lab-to-fab” flexibility to meet the requirements of both R&D and volume production. Plasma-Therm's products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Customers consistently rank Plasma-Therm among the top equipment suppliers, with multiple awards in the annual VLSIresearch Customer Satisfaction Survey, including being named “Ranked 1st” Etch and Clean Equipment Supplier five years in a row.


Quantum Analytics is a value-added distributor, offering customized in-line production control and R&D metrology solutions. Financing options, technical services, including cross-platform system integration, installation, training and support come standard. We have partnered with a number of equipment manufactures to deliver contact-free, non-destructive, high-speed solutions to help keep pace with the growing demand for accurate process control. With platforms ranging from table-top to fully-automated systems, we offer flexible, configurable systems to address specific application needs. The digital holographic microscope (DHM®) allows direct full-field measurements of static and dynamic 3D topography at unrivaled speeds, without any vertical or lateral scanning. This unique acquisition mode makes the DHM® very robust against environmental production vibrations and noise. Its ability to observe and measure energized MEMS devices in real time makes it ideal for the investigation of dynamic processes.


At Revasum, we are dedicated to helping our customers succeed. Whether the goal is to improve performance, reduce costs, or increase productivity, we are diligent in our efforts to provide CMP and grinding solutions to meet these needs. As your requirements change, we want to help develop and further optimize your processes. We are likely to become an extension of your team. Revasum is a new company that acquired the technology from Strasbaugh. Using this technology, we will develop new targeted CMP and grinding equipment. Located in San Luis Obispo, CA, Revasum offers new and certified refurbished systems for sale worldwide.


Silex Microsystems is the world’s largest pure-play MEMS foundry enabling the world’s most innovative companies to participate in the sensory system revolution and commercialize MEMS technologies that are transforming the world. MEMS development requires deep specialized knowledge and expertise as a new device goes from prototype to qualification to mass production. Silex is dedicated to bring customers quickly, cost-effectively and reliably through the product development lifecycle with: expertise in rapid commercialization of MEMS products, pioneering innovation that delivers transformative MEMS manufacturing capabilities, responsive collaborative partnering driven to enable customers’ success, from project inception to volume production and proven, stable, high-volume MEMS manufacturing capacity.


Since 1974, Sonoscan®, the leader in acoustic microscopy (AM), has manufactured systems in the USA and regional support laboratories in Asia, Europe and the USA for AM services. Sonoscan's proprietary C-SAM® technologies have set the standard for over 40 years. Sonoscan provides non-destructive analysis for process control and quality assurance to safeguard your MEMS products as it accurately detects defects and process variations. Sonoscan offers instruments for the laboratory and automated test systems for front, mid and back-end microelectronics, including the AW series for various wafer configurations and the FACTS2™ DF2400™ for scanning MEMS devices in trays. Collaboration with Sonoscan customers and industries has led to many innovations, patents and standards over the years. Specific to the MEMS industry, transducers were developed and built by Sonoscan for bonded wafers, hermetic/cap seal, lab-on-chip and MEMS packaging inspection, plus automated accept/reject methods for die and cavity seal mapping of a wafer.


Teikoku Taping System has been a major equipment supplier in the semiconductor industry for more than 25 years. TTS specializes in designing, developing and manufacturing of semiconductor equipment used for MEMS device processing. TTS is a leader in dry film resist lamination for front end processing and back end equipment for back grind tape lamination, dicing, tape-and-die attach film mounting and UV irradiation capability for UV release tape. Customers will be assured because we are here to assist you throughout your purchase. TTS will provide support for processing set up and service after installation of TTS tools. Teikoku Taping System has three main focus areas: taping (“haru”), de-taping (“hagasu”) and handling (“hakobu”). Engineering support and demo capabilities for the Americas are in Phoenix, AZ.


As a leading global supplier of semiconductor and flat panel display (FPD) production equipment, Tokyo Electron Limited (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL's semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network of approximately 75 locations in 16 countries in the U.S., Europe, and Asia.


ULVAC Technologies, Inc. (ULVAC) was established in 1992 as the US subsidiary of ULVAC, Inc. Headquartered in Methuen, Massachusetts, ULVAC provides a broad portfolio of manufacturing equipment for the vacuum, materials and thin film industries. ULVAC's solutions diversely incorporate equipment, materials, analysis, and services for flat panel displays, electronic components, semiconductors, MEMS and general-industry equipment. In addition, the Methuen facility is equipped with a class-10 cleanroom for process development, customer demonstration and manufacturing of the ENVIRO solvent-free dry photo resist stripper and compound semiconductor materials etch systems. Other in-house services include foundry etch (for deep oxide and compound semiconductor materials), thermal processing, materials characterization, and vacuum pump/leak detector repair. ULVAC supports a variety of MEMS production technologies, for applications ranging from micro sensors to flow channel modules, optical switches, and bio-MEMS.


WACKER is among the world’s leading and most research intensive chemical companies and is a worldwide innovation partner to customers in many key global sectors. Products range from silicones for automotive, transportation, aerospace and many other diverse industries; binders and polymer additives to bioengineered pharmaceutical actives and hyperpure silicon for semiconductor and solar applications. With around 16,900 employees, WACKER generated sales of €5.29 billion (2015). Headquartered in Munich, Germany, WACKER globally has 25 production sites, 21 technical competence centers and 48 sales offices. WACKER is represented regionally in North America by WACKER Chemical Corporation in Adrian, MI. As a technology leader focusing on sustainability and a Responsible Care® member, WACKER promotes products and ideas that offer high value-added potential to ensure a better quality of life based on energy efficiency and protection of the climate and environment. WACKER is certified to ISO 9001 and RC 14001.


X-FAB MEMS Foundry offers unsurpassed experience, expertise and execution with its high-volume MEMS manufacturing service. X-FAB draws on more than 20 years MEMS manufacturing experience and continues to meet the new demands for this rapidly expanding group of technologies in terms of time to market, quality assurance, high yield and supply-chain management tools. Operating from six fabs for MEMS and CMOS processes and an ecosystem of manufacturing and design partners, X-FAB is the proven choice for process development and installation, process capability, design support and long-term manufacturing stability. As well as customer specific process installation, X-FAB offers a range of qualified, in-production, open-platform processes and IP blocks for key MEMS types.


Meeting the stringent demands of companies worldwide, Yield Engineering Systems, Inc. (YES) manufactures processing equipment with cost-effective solutions for wafer-level packaging/redistribution layers, bioMEMS, semiconductor industries and more. YES manufactures high temperature vacuum cure ovens, polyimide cure ovens, silane vapor phase deposition systems, plasma etch and clean tools and vacuum bake/vapor prime ovens; Our proven applications include silane substrate adhesion for microarrays, biocompatibility, stiction reduction, wafer dehydration and surface tension modification. Designing and building products that increase yields, extend performance, and improve processes; all equipment is engineered, manufactured and tested in Livermore, California USA. The answer is YES to quality, flexibility, superior products and service.

Exhibit Opportunities

To ensure a more exclusive and intimate networking environment for both the exhibitors and the attendees, the exhibits will only be open to conference attendees. The exhibit package is only $1,495 and includes the following:

  • One (1) conference and reception admission
  • Printed conference program and presentation slides in electronic format
  • One (1) 6-foot table, draped
  • Two (2) chairs
  • Custom 11”x17” tabletop sign with company logo and description
  • Company logo and description in the printed conference program and on printed conference signage
  • Company logo and description on event website
  • Company logo and description on event dedicated emails to subscribers of MEMS Journal and our media partners; event promotions will reach 70,000 to 80,000 individuals in the MEMS, sensors, electronics, and semiconductor industry segments.

Upgrade to the Deluxe Exhibitor option which enables you to give a 10-minute talk to the entire audience during the Technology Showcase. It's a great way to draw more attention to your company. Deluxe Exhibitor and Technology Showcase spots are limited – click here to register today!

For further information about exhibiting, please contact Jessica Ingram at jessica@memsjournal.com or call 360-929-0114.

Exhibit space is limited. Sign up today!

Past Exhibitors

Many thanks to our exhibitors from the 2015 event.


ClassOne Technology designs and manufactures new advanced wet-chemical process tools – electroplating tools, spray solvent tools, and spin rinse dryers - especially for the cost-sensitive producers of MEMS, power devices, RF, LEDs, photonics, sensors, microfluidics and other emerging technologies. We provide innovative new solutions for a range of applications on 3" to 8" substrates of many materials, including silicon, glass, sapphire, GaAs, GaN, Ge, InP and HgCdTe. ClassOne’s Solstice electroplating systems are available in either manual 2-chamber or fully automated, cassette-to-cassette 4- and 8-chamber configurations. The Solstice performs key processes such as Cu TSV plating, wafer-level packaging plating processes, low-stress Ni plating, cyanide and non-cyanide Au electroplating, in addition to other electroplating processes. ClassOne’s Trident Spray Solvent Tool (SST) is the next generation of batch-processing SSTs for metal lift-off, photoresist strip, polymer removal and other demanding solvent based processes.


CSEM is a private Swiss research and technology organization which delivers advanced technologies and exclusive R&D services to industry. Its operating model is based on a public-private partnership. This unique relationship with the Swiss Confederation gives the company a greater flexibility to address broad ranges of applied research areas to face the challenges of tomorrow, to pursue its commitment to innovation, and finally to ensure economic stimuli even in times of crisis.

CSEM offers its customers a full solution including MEMS, ASIC, system integration, packaging and testing, all with the guarantee of the utmost reliability. With its state-of-the-art cleanroom, CSEM provides industry with small-scale production of MEMS components as well as packaged microsystems. Expertise across the entire chain makes CSEM the right partner for silicon-based microfabrication. A 450-strong workforce with industrial backgrounds, mostly top-level engineers and holders of PhDs, dedicates its passion to technologies that make the difference.


DHK Solution is a Korean joint venture founded with Disco Corporation as an exclusive distributor of Disco precision wafer processing equipment in Korea. We sell equipment and provide engineering support to our customers. We also develop wafer-dicing process and provide wafer processing service to worldwide fabless device developers and manufacturers. Our service includes wafer and die thinning, dicing and packing to customer’s needs. Our expertise gained from the beginning of the Korean semiconductor industry combined with Disco’s equipment and process technologies guarantees the highest quality wafer processing service over diversity of substrate materials, device structures and form factors. We are dedicated to provide the highest quality service to our customers worldwide from the initial process development to medium volume manufacturing service.


Precious metal reclaim & refining - refiners of platinum, gold, silver, palladium, rhodium generated from solder dross, thick & thin film paste, gold wire, heat shields, jewelry, dental appliances, etc. Geib Refining is ITAR & ISO compliant.

Our clientele ranges from the US Federal Government to defense contractors to industrial plants to jewelry manufacturers to small R&D facilities.  No matter what the originating source, the commonality for lot settlements begins with 100% processing and highly accurate sampling and assaying.  Whether it's melting, incineration, milling, chemical stripping, or solutions recovery, all of your material is processed at Geib and professionally controlled.  As a precious metals generator, you must demand homogeneous refining; we meet your demands on each and every lot.


Hadland Technologies provides high-quality, cost-effective, 3-D inspection services using X-ray computed tomography for use in research & development, manufacturing, failure analysis, and academia. X-ray CT is a nondestructive technique useful for material segmentation, porosity/inclusion analysis, geometric measurement, fiber composite analysis, and defect detection. Whether in R&D or final manufacturing, X-ray CT can be used to examine the internal structure of a product to ensure manufacturing conformance, to detect manufacturing process problems, or for failure analysis. With over 20 years of experience in microfocus X-ray technology, Hadland Technologies has partnered with the aerospace, electronics, automotive, medical, dental, pharmaceutical, defense, materials, and oil industries and academic institutions.


IMT offers the most complete MEMS foundry services in our fully automated 30,000 sq ft, 6” wafer fab.  IMT’s extensive product experience includes DC and RF switching, drug discovery/delivery, microfluidics, cell sorting, inertial navigation, optotelecom, IR emitters, and others.  IMT offers wafer bonding for both hermetic packaging/encapsulation and microfluidics including: fusion bonding, anodic bonding, glass frit bonding, Au-Au thermocompression bonding, metal alloy bonding and various types of polymer bonds.  IMT’s wafer-level packaging and through silicon via technologies are production proven for the next generation 3D packaging and interposer applications.  IMT is ISO 9001 certified offering complete turn-key foundry services from design through high-volume production.  We bring our customers’ MEMS to volume production.  Speak with an IMT representative to see how we can make your MEMS work for you.


Integrated Surface Technologies (IST) designs and manufactures Surface Modification Systems for the MEMS and Biotech industries. Organic and Inorganic molecular films can be deposited in your lab or factory by using IST’s sub-atmospheric, low temperature vapor and plasma enabled deposition equipment. It can fulfill every level of surface engineering requirements for the industry. From bench top systems for R&D and pilot production, to full size manufacturing systems, IST supplies the equipment, the chemistry and engineering services. Typical applications include: anti-stiction monolayers, adhesion promoters, release layers, hydrophilic-to-super-hydrophobic coatings, atomic layer deposition (ALD) of metal-oxides, and many other customer specific films. Our engineers can help you to select the best chemistry for each specific application. The correct chemistry is then delivered in cartridges for easy change over in the systems, to keep production running and for R&D flexibility.


MSG Lithoglas designs, manufactures and markets wafer-level components of high optical quality on the basis of our structurable low-temperature glass deposition technology. The glass layers serve as moisture barriers, optical thin films and maybe be employed for anodic bonding of substrates. We address growth markets like passivation or encapsulation of electronic components and semiconductors, MEMS or MOEMS. Lithoglas' patented unique glass technology offers highly hermetic and reliable precisely structured glass coatings, which are available as a subcontractor service. Certified according to ISO 9001:2008, quality is a fundamental element of our company's philosophy.


Micralyne is a leading independent MEMS and microfabrication foundry. We excel at creating process technology for complex MEMS devices and execute disciplined volume manufacturing. Micralyne extends its value to our customers by offering extensive packaging, testing, and design services, beyond a typical MEMS chip foundry. This Foundry Plus model has successfully produced products for industries such as: life sciences, aerospace, automotive, oil and gas, telecom, and industrial sensors. Micralyne offers our customers a strategic partnership with deep technical knowledge and fabrication capabilities. Our fabrication services fit their need by providing established process platforms and timely device fabrication through early prototype, qualification, and volume manufacturing.


Located in San Jose, California, Micrel has to date completed foundry work for several customers and has completed successful MEMS prototypes of accelerometer, microphone, pressure sensor, inkjet, microprobe, and bioMEMS devices. In 2011, Micrel installed additional MEMS foundry manufacturing capabilities, including DRIE, low-stress Nitride, thin-wafer, front to back alignment, etc. In 2014 Micrel completed its installation of a EVG Gemini wafer bonder, along with HF release capabilities. Micrel has qualified TSV capabilities and equipping itself for emerging MEMS technologies in order to meet future customer needs.


MicroChem Corp is a leading manufacturer of electronic materials that focuses on providing innovative chemicals solutions to the MEMS and other microelectronic markets. We offer a broad suite of products including SU-8 permanent epoxy resists for microfluidic and RF MEMS applications and PMGI and LOR resists for additive lift-off processing. MicroChem is introducing several new materials targeted towards MEMS packaging, including PermiNex, a low temperature, permanent, photoimagable wafer bonding adhesive, MicroSPDF, a low stress, photoimageable encapsulation/passivation material with excellent dielectric and thermal properties, and SU-8 3000 CF DFR dry film resist, developed to be low halogen and antimony-free and intended for fabrication of chemically and thermally stable structures such as walls and capping layers in cavity packaging. MicroChem is a wholly owned subsidiary of Nippon Kayaku Co. Ltd., Tokyo, Japan.


MUEGGE GmbH is an internationally leading manufacturer and provider of industrial microwave heating and microwave plasma systems and of the related components. For more than 25 years, MUEGGE has developed, produced and supplied high-quality microwave continuous wave (cw) and pulse solutions for applications which require power ranges of 300W to 100kW of single microwave power systems at frequencies of 5800MHz, 2450MHz and 915MHz. MUEGGE continues to develop and integrate industry-leading microwave power solutions that are optimized and integrated into state-of-the-art and future-oriented technologies. The most demanding requirements are met by MUEGGE's advanced systems, plant and process technologies, resulting in an integrated concept that is based upon the scientific and technological experience of the ISO 9001:2008 certified company. MUEGGE offers high voltage, microwave and plasma sources for various sizes, power levels and applications. MUEGGE product developments include large area linear plasma sources, remote plasma sources, modular plasma arrays and various small, medium and large area industrial heating applications. Field offices and partner companies are located in the USA, Japan, Taiwan and China, providing international field service and technical support. Since the end of 2008, MUEGGE is incorporated into Roth&Rau AG, which itself is part of Meyer Burger Technology AG since 2011.


Pentagon Technologies, Inc. is a leading provider of mission-critical manufacturing support services and contamination detection and protection products to the semiconductor, microelectronic, MEMS, life science and solar industries. Pentagon’s collaborative approach with customers, proprietary services and products regularly provide improvements in manufacturing cost of ownership.


scia Systems manufactures advanced ion beam and plasma processing equipment. The systems are used in production of microelectronics, MEMS and precision optical components, in both high volume production as well as research and development environments. The industry-proven “scia Trim 200” system is used for frequency and thickness trimming to Angstrom precision in manufacturing of BAW/SAW devices. Another key product is the “scia Magna 200”, used in the deposition of SiO2 temperature compensation films and piezoelectric films such as AlN. The “scia Magna 200” delivers high uniformity, high deposition rates, and excellent material properties, due to its unique Double Ring Magnetron architecture. The tools are flexible and modular in design, allowing several vacuum process chambers to be combined into cluster or in-line layouts, according to customer-specific requirements. scia Systems provides highly reliable tools together with superior technology, process, and service support.


SEMSYSCO is the semiconductor equipment manufacturer specializing in wet and vapor chemical process technologies, utilized in semiconductor and many other high-tech applications. Our highly experienced staff has been working in the semiconductor industry for over 25 years and has been responsible for much of the wet-process innovations, utilized in leading FABs world-wide. SEMSYSCO's product portfolio fully addresses today's etching, cleaning, electroless & ECD plating, and PR stripping challenges, for both batch and single wafer processing. Our technical partners include IME, Fraunhofer, Atotech and Ancosys. Headquartered in Salzburg, Austria, SEMSYSCO is your global partner for all wet-process solutions and maintains sales and service support centers throughout Europe, Asia and the USA. SEMSYSCO applications cover: advanced packaging; UBM etch - PR strip, Cu pillar & TSV ECD plating, ENEPIG, and an all wet TSV approach; FEOL - ozone post ash clean, oxide & metal etch, PR strip; BEOL - metal etch, barrier etch, PR strip, ECD; MEMS - porous silicon etch, HF etch, PR strip, ECD, oxide etch, metal etch.


Siconnex is a global leading equipment manufacturer for the semiconductor and related industries. Siconnex provides surface preparation equipment and processes, including WET BATCHSPRAY systems (etch, clean, resist strip) for the III-V semiconductor, MEMS, wireless, power, energy harvesting, WLP, data storage and logic industries.

The process technologies at Siconnex help to make innovations like smartphones, solar panels and power electronics more affordable and accessible to consumers and businesses around the world. Siconnex systems are leading when an extremely small footprint, safety, full automation, high throughput and economical resource consumption is important.


Springer is a leading science and technology publisher and database provider for the MEMS and Semiconductor industry. Springer offers authoritative eBooks, eJournals, and SpringerMaterials database for businesses and corporations innovating anywhere in the supply chain of the MEMS industry, from foundries through end devices. Springer’s content is of high relevance for researchers, developers and engineers designing applications for diverse commercial markets such as IoT, wearables, autonomous vehicles, robotics, digital health, precision agriculture, smart home, environmental monitoring, and many others. SpringerMaterials is the world's largest database for physical and chemical properties in Materials Science and where leading companies source materials, processing technology, characterization methods, or novel architecture, and more. Contact us for more information RD@springer.com or visit springer.com/RD


Strasbaugh manufactures CMP and grinding equipment for use in the production of nanotechnology for the Internet of Things (IoT), mobile computing platforms, LED lighting and a wide array of semiconductor devices. Since Strasbaugh was founded in 1948, the company has helped its customers realize their performance targets and has built a reputation as a world-class manufacturer of innovative, reliable, high-yield surfacing solutions. Located in San Luis Obispo, CA, Strasbaugh offers new and certified remanufactured systems for sale worldwide. For more information, please visit Strasbaugh.com.


As a major supplier in the semiconductor industry for more than 25 years, Teikoku Taping System specializes in designing, developing, and manufacturing custom-engineered backend semiconductor equipment used for MEMS dry film resist lamination, dicing tape-and-die attach film mounting, back grind tape lamination, and UV irradiation.


ULVAC Technologies, Inc. (ULVAC) was established in 1992 as the US subsidiary of ULVAC, Inc. Headquartered in Methuen, Massachusetts, ULVAC provides a broad portfolio of manufacturing equipment for the vacuum, materials and thin film industries. ULVAC's solutions diversely incorporate equipment, materials, analysis, and services for flat panel displays, electronic components, semiconductors, MEMS and general-industry equipment. In addition, the Methuen facility is equipped with a class-10 cleanroom for process development, customer demonstration and manufacturing of the ENVIRO solvent-free dry photo resist stripper and compound semiconductor materials etch systems. Other in-house services include foundry etch (for deep oxide and compound semiconductor materials), thermal processing, materials characterization, and vacuum pump/leak detector repair. ULVAC supports a variety of MEMS production technologies, for applications ranging from micro sensors to flow channel modules, optical switches, and bio-MEMS.


Unisem is a global provider of semiconductor assembly and test (OSAT) services for many of the world’s most successful electronics companies. We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF, analog, digital, and mixed signal test. Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterization and modeling.

Unisem is an established MEMS OSAT with several years of experience in volume consumer and automotive production, in addition to a broad package portfolio covering multiple applications. The company has factory locations in Ipoh, Malaysia; Chengdu, People’s Republic of China; Batam, Indonesia; and Sunnyvale, USA. Unisem is headquartered in Kuala Lumpur, Malaysia.


VAT is a global company with its headquarters in Haag, near St. Gallen in Switzerland. We are the global leader in the development and manufacture of vacuum valves, modules, bellows, and related services for the semiconductor and vacuum coating industries as well as for the research sector. We employ over 1,100 people worldwide with a fifth of our staff working in research and product development. Our customer-facing activities are organized into 3 regions: the Americas, based in Massachusetts and California; EMEA, based in Munich; and Asia. Each region has sales, service and engineering support across the major countries of the region to ensure our customers get the best professional advice, around the clock. Our products are mainly used in the areas of: semiconductor, flat-screen and photovoltaic panel manufacturing, coating of glass and tools, metallurgy, surface analysis, high energy physics, synchrotrons, laser technology, and space travel simulation.


WRS has manufactured SOI for several years. Our direct bonding and SOI manufacturing process is similar to that being used by several other SOI manufacturers, however WRS has developed its own edge treatment process with precise control of edge terrace shape, width and thickness. WRS can thin and polish down to 50um.